{"product_id":"electronic-packaging-and-interconnection-handbook-4e-9780071430487","title":"Electronic Packaging and Interconnection Handbook 4\/E","description":"\u003cp\u003e\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003c\/b\u003e\u003cbr\u003e\u003cb\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003eTHE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING--COMPLETELY UPDATED\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003eFrom new materials and technologies to increasingly prevalent lead-free manufacturing practices, the \u003ci\u003eElectronic Packaging and Interconnection Handbook\u003c\/i\u003e offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.\u003c\/p\u003e\n\u003cp\u003eOf interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.\u003c\/p\u003e\n\u003cp\u003eWhether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the \u003ci\u003eElectronic Packaging and Interconnection Handbook\u003c\/i\u003e makes an excellent addition to your reference arsenal.\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eWritten by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: \u003c\/b\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eMaterials\u003c\/li\u003e\n\u003cli\u003eThermal Management\u003c\/li\u003e\n\u003cli\u003eShock, Vibration, and Operational Stress Management\u003c\/li\u003e\n\u003cli\u003eConnector and Interconnection Technologies\u003c\/li\u003e\n\u003cli\u003eSoldering and Cleaning Technologies\u003c\/li\u003e\n\u003cli\u003eSingle Chip Packaging and Ball Grid Arrays\u003c\/li\u003e\n\u003cli\u003eSurface Mount Technology\u003c\/li\u003e\n\u003cli\u003eHybrid and Multichip Modules\u003c\/li\u003e\n\u003cli\u003eChip-Scale, Flip-Chip, and Direct-Chip Attachment\u003c\/li\u003e\n\u003cli\u003eRigid and Flexible Printed-Wiring Boards\u003c\/li\u003e\n\u003cli\u003ePackaging High-Speed and Microwave Systems\u003c\/li\u003e\n\u003cli\u003ePackaging High-Voltage Systems\u003c\/li\u003e\n\u003cli\u003ePackaging of MEMs Systems\u003c\/li\u003e\n\u003cli\u003ePackaging of Optoelectronic Systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Charles Harper\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e McGraw-Hill Companies\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 10\/19\/2004\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 1000\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 4.30lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 10.20h x 7.10w x 2.40d\u003cbr\u003e\u003cb\u003eISBN:\u003c\/b\u003e 9780071430487\u003cbr\u003e\u003cbr\u003e\u003cb\u003eReview Citation(s): \u003c\/b\u003e\u003cbr\u003e\u003ci\u003eSciTech Book News\u003c\/i\u003e 12\/01\/2004 pg. 155\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003cb\u003eCharles A. Harper\u003c\/b\u003e is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also series editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he also served as an adjunct professor.\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e\u003ci\u003eThis title is not returnable\u003c\/i\u003e\u003cbr\u003e\u003c\/p\u003e","brand":"McGraw-Hill Companies","offers":[{"title":"Hardcover","offer_id":39924023427187,"sku":"0071430482","price":331.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0555\/9255\/0515\/products\/img_0e2aae6c-b942-4194-a660-777365b60517.jpg?v=1647436186","url":"https:\/\/bookstorenmore.com\/en-de\/products\/electronic-packaging-and-interconnection-handbook-4e-9780071430487","provider":"Bookstore N More","version":"1.0","type":"link"}