{"product_id":"high-frequency-characterization-of-electronic-packaging-9780792383079","title":"High-Frequency Characterization of Electronic Packaging","description":"\u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. \u003cbr\u003e \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. \u003cbr\u003e \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Luc Martens\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Springer\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 10\/31\/1998\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 158\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 0.83lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.57h x 6.33w x 0.67d\u003cbr\u003e\u003cb\u003eISBN:\u003c\/b\u003e 9780792383079\u003cp\u003e\u003ci\u003eThis title is not returnable\u003c\/i\u003e\u003cbr\u003e\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Hardcover","offer_id":40133700223091,"sku":"9.78E+12","price":152.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0555\/9255\/0515\/products\/img_1e5a890b-35a1-452f-b4f1-b833b7d153bc.jpg?v=1654176174","url":"https:\/\/bookstorenmore.com\/en-de\/products\/high-frequency-characterization-of-electronic-packaging-9780792383079","provider":"Bookstore N More","version":"1.0","type":"link"}