{"product_id":"semiconductor-packaging-materials-interaction-and-reliability-9781138075405","title":"Semiconductor Packaging: Materials Interaction and Reliability","description":"\u003cp\u003eThis easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Andrea Chen,Randy Hsiao-Yu Lo\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e CRC Press\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 04\/10\/2017\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 216\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 0.69lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.21h x 6.14w x 0.46d\u003cbr\u003e\u003cb\u003eISBN:\u003c\/b\u003e 9781138075405\u003cbr\u003e\u003cp\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eAndrea Chen\u003c\/strong\u003e is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRandy Hsiao-Yu Lo\u003c\/strong\u003e is president of Siliconware USA, Inc. He was previously the vice president of R\u0026amp;D at SPIL, leader of the Electronic Packaging Development group at ERSO\/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.\u003c\/p\u003e\u003cbr\u003e","brand":"CRC Press","offers":[{"title":"Paperback","offer_id":44029750182003,"sku":"9.78114E+12","price":149.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0555\/9255\/0515\/files\/img_3b189ca0-55ed-4089-9a50-d8ab0bcfe32e.jpg?v=1761398796","url":"https:\/\/bookstorenmore.com\/en-de\/products\/semiconductor-packaging-materials-interaction-and-reliability-9781138075405","provider":"Bookstore N More","version":"1.0","type":"link"}