{"product_id":"sip-system-in-package-design-and-simulation-mentor-ee-flow-advanced-design-guide-9781119045939","title":"Sip System-In-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide","description":"\u003cp\u003e\u003cb\u003eAn advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eWritten by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. \u003c\/p\u003e \u003cp\u003eExtensively illustrated throughout, \u003ci\u003eSystem in Package Design and Simulation\u003c\/i\u003e covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: \u003c\/p\u003e \u003cul\u003e \u003cli\u003eCavity and sacked dies design\u003c\/li\u003e \u003cli\u003eFlipChip and RDL design\u003c\/li\u003e \u003cli\u003eRouting and coppering\u003c\/li\u003e \u003cli\u003e3D Real-Time DRC check\u003c\/li\u003e \u003cli\u003eSiP simulation technology\u003c\/li\u003e \u003cli\u003eMentor SiP Design and Simulation Platform\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eDesigned to function equally well as a reference, tutorial, and self-study, \u003ci\u003eSystem in Package Design and Simulation\u003c\/i\u003e is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. \u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e Suny Li (Li Yang)\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Wiley\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 07\/24\/2017\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 400\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 2.00lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.70h x 6.90w x 1.20d\u003cbr\u003e\u003cb\u003eISBN:\u003c\/b\u003e 9781119045939\u003cbr\u003e\u003cp\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003cb\u003e Mr. Suny Li (Li Yang)\u003c\/b\u003e is a SiP\/PCB Technical Specialist in China; he now works in AcconSys Technology Co. Ltd, (a Mentor Authorized Distributor for China). Suny has guided and consulted on dozens of SiP projects in China, accumulating plentiful experience in SiP design and simulation. Suny has 10 years' experience in and knowledge of Application Engineer for Mentor, especially in SiP\/PCB design and simulation. Before this, Suny worked in the Chinese Academy of Science and SIEMENS for several years. He has more than seven years' experience in hardware design (HW system design, PCB layout, high-speed signal integrity, power integrity, EMI, etc.). In the course of his work, Suny has published papers and acquired four patents, and he continues with this work. Suny is a senior member of the Chinese Institute of Electronics (CIE) and a member of the IEEE. Suny graduated from Beijing University of Aeronautics \u0026amp; Astronautics (BUAA) in 2000, receiving Master's and Bachelor's degrees in Science and Technology of Aeronautics \u0026amp; Astronautics.\u003cbr\u003e\u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Hardcover","offer_id":44699242102899,"sku":"9781119045939","price":223.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0555\/9255\/0515\/files\/img_41b6c733-2d91-4e61-806c-078097e2496b.jpg?v=1775338340","url":"https:\/\/bookstorenmore.com\/en-de\/products\/sip-system-in-package-design-and-simulation-mentor-ee-flow-advanced-design-guide-9781119045939","provider":"Bookstore N More","version":"1.0","type":"link"}