Chip on Board: Technology for Multichip Modules

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Author: John H. Lau
Publisher: Springer
Published: 06/30/1994
Pages: 556
Binding Type: Hardcover
Weight: 2.04lbs
Size: 9.36h x 6.00w x 1.34d
ISBN: 9780442014414

This title is not returnable