Electromigration in Metals: Fundamentals to Nano-Interconnects

Author: Paul S. Ho, Chao-Kun Hu, Martin Gall
Publisher: Cambridge University Press
Published: 05/12/2022
Binding Type: Hardcover
Weight: 2.10lbs
Size: 9.90h x 6.90w x 0.75d
ISBN: 9781107032385

About the Author
Ho, Paul: - Paul Ho is Professor Emeritus in the Department of Mechanical Engineering and the Texas Materials Institute at the University of Texas at Austin. He has received research awards from the Electrochemical Society, IEEE, IITC and Semiconductor Industry Association, among others.Hu, Chao-Kun: - Chao-Kun Hu has recently retired as a Research Staff Member in the Reliability Department at the T.J. Watson Research Center of IBM. He received IBM Corporate awards, IEEE Cledo Brunetti award, EDS Recognition and IITC Best Paper awards, and Invention of the Year NY Intellectual Property Law Association.Gall, Martin: - Martin Gall is the director of the U.S. Operations Reliability Engineering Department at GLOBALFOUNDRIES Inc. He is an IEEE TDMR editor and the recipient of an IEEE IITC Best Paper and SRC Mentor of the Year Award.
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