Failure Analysis of Integrated Circuits: Tools and Techniques

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a must have' reference work for semiconductor professionals and researchers.

Author: Lawrence C. Wagner
Publisher: Springer
Published: 11/09/2012
Pages: 255
Binding Type: Paperback
Weight: 0.85lbs
Size: 9.21h x 6.14w x 0.57d
ISBN: 9781461372318

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