Semiconductor Packaging: Materials Interaction and Reliability

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Author: Andrea Chen,Randy Hsiao-Yu Lo
Publisher: CRC Press
Published: 04/10/2017
Pages: 216
Binding Type: Paperback
Weight: 0.69lbs
Size: 9.21h x 6.14w x 0.46d
ISBN: 9781138075405

About the Author

Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.

Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.